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- [2] Microstructure and interface evolution of Sn-2.5Bi-1.4In-1Zn-0.3Ag/Cu joint during isothermal aging Journal of Materials Science: Materials in Electronics, 2013, 24 : 4122 - 4128
- [8] Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering Journal of Materials Science: Materials in Electronics, 2015, 26 : 7967 - 7976
- [10] Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface Journal of Materials Engineering and Performance, 2014, 23 : 1630 - 1633