Fast library-building method for 3D capacitance extraction with variation of process parameters

被引:0
|
作者
Department of Computer Science and Technology, Tsinghua University, Beijing 100084, China [1 ]
机构
来源
Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao | 2006年 / 12卷 / 1837-1843期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Neural Network-Based 3D IC Interconnect Capacitance Extraction
    Kasai, Ryosuke
    Hachiya, Koutaro
    Kanamoto, Toshiki
    Imai, Masashi
    Kurokawa, Atsushi
    PROCEEDINGS OF 2019 2ND INTERNATIONAL CONFERENCE ON COMMUNICATION ENGINEERING AND TECHNOLOGY (ICCET 2019), 2019, : 168 - 172
  • [42] A 3D Interactive Visualization Program for Interconnect Capacitance Extraction of Integrated Circuits
    Yan Y.
    Yu W.
    Pei C.
    Hu C.
    Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics, 2022, 34 (04): : 507 - 514
  • [43] 3D IC Interconnect Parasitic Capacitance Extraction with a Reformulated PGD Algorithm
    Li, Yalan
    Tan, Shuai
    Xu, Xiaoyu
    Lyu, Pengfei
    Ren, Zhuoxiang
    2016 IEEE CONFERENCE ON ELECTROMAGNETIC FIELD COMPUTATION (CEFC), 2016,
  • [44] Polylidar3D-Fast Polygon Extraction from 3D Data
    Castagno, Jeremy
    Atkins, Ella
    SENSORS, 2020, 20 (17) : 1 - 42
  • [45] Parallel algorithm for chip-level 3D parasitic capacitance extraction
    Zheng, Lanzhou
    Yu, Wenjian
    Yin, Hang
    Wang, Zeyi
    Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics, 2008, 20 (11): : 1396 - 1402
  • [46] An efficient algorithm for 3D interconnect capacitance extraction considering floating conductors
    Cueto, O
    Charlet, F
    Farcy, A
    SISPAD 2002: INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2002, : 107 - 110
  • [47] Fast and robust local feature extraction for 3D reconstruction
    Cao, Mingwei
    Jia, Wei
    Li, Yujie
    Lv, Zhihan
    Li, Lin
    Zheng, Liping
    Liu, Xiaoping
    COMPUTERS & ELECTRICAL ENGINEERING, 2018, 71 : 657 - 666
  • [48] 3D deterministic ray tracing method for massive MIMO channel modelling and parameters extraction
    Liu, Gang
    She, Jun
    Lu, Wenjun
    Zhang, Ming
    Bo, Yaming
    IET COMMUNICATIONS, 2020, 14 (18) : 3169 - 3174
  • [49] Laser 3D Machining with Variable Process Parameters
    Wang, Xuyue
    Wang, J.
    INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES, PTS ONE AND TWO, 2010, 1315 : 1157 - +
  • [50] AI 3D Printing Process Parameters Optimization
    Seok, Park Hong
    Nguyen Dinh Son
    ICAART: PROCEEDINGS OF THE 12TH INTERNATIONAL CONFERENCE ON AGENTS AND ARTIFICIAL INTELLIGENCE, VOL 2, 2020, : 356 - 361