Effects of magnetic fields on microstructure, microhardness and electrochemical corrosion of Sn-9Zn solder

被引:0
|
作者
机构
[1] [1,Wu, Min
[2] Liu, Zheng-Jun
来源
Wu, M. (Wumin_1@sina.com) | 2012年 / Central South University of Technology卷 / 22期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Heat resistance of Sn-9Zn solder/Cu interface with or without coating
    Katsuaki Suganuma
    Toshikazu Murata
    Hiroji Noguchi
    Yoshitaka Toyoda
    Journal of Materials Research, 2000, 15 : 884 - 891
  • [42] Comments on "Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints"
    Paul, A.
    Laurila, T.
    INTERMETALLICS, 2012, 28 : 164 - 165
  • [43] Reliability studies of Sn-9Zn/Cu solder joints with aging treatment
    Yoon, Jeong-Won
    Jung, Seung-Boo
    Journal of Alloys and Compounds, 2006, 407 (1-2): : 141 - 149
  • [44] Investigation on properties of Ga to Sn-9Zn lead-free solder
    Chen, Wenxue
    Xue, Songbai
    Wang, Hui
    Wang, Jianxin
    Han, Zongjie
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 21 (05) : 496 - 502
  • [45] Heat resistance of Sn-9Zn solder/Cu interface with or without coating
    Suganuma, K
    Murata, T
    Noguchi, H
    Toyoda, Y
    JOURNAL OF MATERIALS RESEARCH, 2000, 15 (04) : 884 - 891
  • [46] Effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
    Zhang, X. F.
    Guo, J. D.
    Shang, J. K.
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 694 - 697
  • [47] Effect of reflow time on shear property of Sn-9Zn solder bumps
    Sun, Menglong
    Zhao, Qinghua
    Wang, Dongfan
    Hu, Anmin
    Li, Ming
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1035 - 1038
  • [48] Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
    Mittal, Jagjiwan
    Kuo, Shih-Ming
    Lin, Yu-Wei
    Lin, Kwang-Lung
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) : 2436 - 2442
  • [49] Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
    Jagjiwan Mittal
    Shih-Ming Kuo
    Yu-Wei Lin
    Kwang-Lung Lin
    Journal of Electronic Materials, 2009, 38 : 2436 - 2442
  • [50] Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy
    Jing, Yanxia
    Sheng, Guangmin
    Zhao, Guoji
    MATERIALS & DESIGN, 2013, 52 : 92 - 97