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- [27] Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 392 - 396
- [29] Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy Journal of Electronic Materials, 2009, 38 : 330 - 337