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- [4] Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints Journal of Electronic Materials, 2010, 39 : 200 - 208
- [10] Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy Journal of Alloys and Compounds, 2009, 481 (1-2): : 167 - 172