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- [3] Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1744 - 1747
- [4] Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates ZEITSCHRIFT FUR METALLKUNDE, 2002, 93 (02): : 95 - 98
- [5] Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 473 - 476
- [7] Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1478 - 1482
- [8] Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate Zhongguo Youse Jinshu Xuebao, 2007, 7 (1083-1089):