Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate

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作者：
College of Mechanical Engineering, South China University of Technology, Guangzhou 510641, China [1 ]
不详 [2 ]
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来源：
Zhongguo Youse Jinshu Xuebao | 2007年 / 7卷 / 1083-1089期
关键词：
Soldering alloys;
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