Wetting behavior and interfacial reactions in (Sn-9Zn)-2Cu/Ni joints during soldering and isothermal aging

被引：0
|
作者：
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China [1 ]
机构：
来源：
J Mater Sci Technol | 2009年 / 3卷 / 410-414期
关键词：
21;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging
    Zhongbing Luo
    Lai Wang
    Qinqin Fu
    Chongqian Cheng
    Jie Zhao
    Journal of Materials Research, 2011, 26 : 1468 - 1471
  • [42] Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings during reflow soldering
    Diao, Hui
    Wang, Chun-Qing
    Zhao, Zhen-Qing
    Tian, Yan-Hong
    Kong, Ling-Chao
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2007, 17 (03): : 410 - 416
  • [43] Formation of interfacial η′-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging
    Luo, Zhongbing
    Wang, Lai
    Fu, Qinqin
    Cheng, Chongqian
    Zhao, Jie
    JOURNAL OF MATERIALS RESEARCH, 2011, 26 (12) : 1468 - 1471
  • [44] The growth behavior of inteimetallic compound layers of Sn-3Ag/Cu and Sn/Cu joints during soldering and aging
    Cheng, Cong-qian
    Yang, Peng
    Zhao, Jie
    Zhu, Feng
    Song, Qmg-Yang
    2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 12 - +
  • [45] Growth behavior of interfacial Cu-Sn intermetallic compounds of Sn/Cu reaction couples during dip soldering and aging
    Hu, Xiaowu
    Ke, Zunrong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (02) : 936 - 945
  • [46] Growth behavior of IMCs in Sn-1.0Ag-0.5Cu-xBi/Ni joints during isothermal aging
    Wang, Jianxin
    Su, Hao
    Mu, Dekui
    Kong, Xingda
    Jin, Yiming
    Shi, Xixi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (15) : 20777 - 20792
  • [47] Effect of Cu addition on interfacial reaction between Sn-9Zn solder and Ag
    Yen, Yee-Wen
    Jao, Chien-Chung
    Lee, Chiapyng
    JOURNAL OF MATERIALS RESEARCH, 2006, 21 (12) : 2986 - 2990
  • [48] Effect of nano Al2O3 additions on the interfacial behavior and mechanical properties of eutectic Sn-9Zn solder on low temperature wetting and soldering of 6061 aluminum alloys
    Xing, Wen-qing
    Yu, Xin-ye
    Li, Heng
    Ma, Le
    Zuo, Wei
    Dong, Peng
    Wang, Wen-xian
    Ding, Min
    JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 695 : 574 - 582
  • [49] Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging
    Chi-Yang Yu
    Jenq-Gong Duh
    Journal of Materials Science, 2012, 47 : 6467 - 6474
  • [50] Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn Lead-free Solders with the Au/Ni/SUS 304 Substrate
    Chen, Kuen-da
    Chen, Hao
    Yen, Yee-wen
    IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 533 - 535
12345