Strength improvement of a smart adhesive bonded joint system by partially integrated piezoelectric patches

被引：0
|
作者：
Cheng, Jinquan [1 ]
Taheri, Farid [1 ]
Han, Haipeng [1 ]
机构：
[1] Department of Civil Engineering, Dalhousie University, 1360 Barrington Street, Halifax, NS B3J 1Z1, Canada
来源：
Journal of Adhesion Science and Technology | 2006年 / 20卷 / 06期
关键词：
33;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
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页码：503 / 518
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