Strength improvement of a smart adhesive bonded joint system by partially integrated piezoelectric patches

被引：0

作者：

Cheng, Jinquan ^{[1
]}

Taheri, Farid ^{[1
]}

Han, Haipeng ^{[1
]}

机构：

[1] Department of Civil Engineering, Dalhousie University, 1360 Barrington Street, Halifax, NS B3J 1Z1, Canada

来源：

Journal of Adhesion Science and Technology | 2006年 / 20卷 / 06期

关键词：

33;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Journal article (JA)

引用

页码：503 / 518

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