Hybrid Bonding for 3D Integration

被引：0
|
作者：
Fujino, Masahisa [1 ]
机构：
[1] National Institute of Advanced Industrial Science and Technology (AIST), Central-1, Umezono 1-1-1, Ibaraki, Tsukuba,305-8560, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 04期
关键词：
D O I：
10.5104/jiep.26.374
中图分类号：
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摘要：
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页码：374 / 379
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