Study of Cu Micro-via by TOF-SIMS and STEM

被引：0

作者：

Nishijima, Masahiko ^{[1
]}

Hsieh, Ming-Chun ^{[1
]}

Zheng, Zhang ^{[1
]}

Suetake, Aiji ^{[1
]}

Yoshida, Hiroshi ^{[1
]}

Okumuara, Rieko ^{[1
]}

Chen, Chuantong ^{[1
]}

Homma, Hidekazu ^{[2
]}

Kita, Koji ^{[2
]}

Suganuma, Katsuaki ^{[1
]}

机构：

[1] Osaka University, Flexible 3D System Integration Lab, SANKEN, Japan

[2] Okuno Chemical Industries Co. Ltd., Japan

来源：

2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年

关键词：

Engineering Village;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Cu layers - Cu micro-via - Electroless - Electroless cu - Electroless Cu plating - Nano-voids - Potential risks - Sandwiched structure - Scanning transmission electron microscopy - Time of flight secondary ion mass spectrometry

引用

页码：151 / 152

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