Study of Cu Micro-via by TOF-SIMS and STEM

被引：0
|
作者：
Nishijima, Masahiko [1 ]
Hsieh, Ming-Chun [1 ]
Zheng, Zhang [1 ]
Suetake, Aiji [1 ]
Yoshida, Hiroshi [1 ]
Okumuara, Rieko [1 ]
Chen, Chuantong [1 ]
Homma, Hidekazu [2 ]
Kita, Koji [2 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Osaka University, Flexible 3D System Integration Lab, SANKEN, Japan
[2] Okuno Chemical Industries Co. Ltd., Japan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Engineering Village;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Cu layers - Cu micro-via - Electroless - Electroless cu - Electroless Cu plating - Nano-voids - Potential risks - Sandwiched structure - Scanning transmission electron microscopy - Time of flight secondary ion mass spectrometry
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页码：151 / 152
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