Effect of ANSA as an additive on electrodeposited Sn-Ag-Cu alloy coatings in deep eutectic solvent

被引：0
|
作者：
Wu, Qihu [1 ]
Huang, Jiacheng [1 ]
Wang, Wenchang [1 ]
Ming, Zhiyao [1 ]
Wu, Minxian [1 ]
Qin, Shuiping [2 ]
Wang, Pengju [3 ]
Mitsuzaki, Naotoshi [2 ]
Chen, Zhidong [1 ]
机构：
[1] Changzhou University, School of Petrochemical Engineering, Changzhou,213164, China
[2] Qualtec Materials Technology (Changzhou) Co., Ltd., Changzhou,213164, China
[3] Jiangsu Mingfeng Electronics& Material Technology Co., Ltd., Changzhou,213164, China
来源：
Journal of Molecular Liquids | 2024年 / 414卷
关键词：
Compendex;
D O I：
10.1016/j.molliq.2024.126161
中图分类号：
学科分类号：
摘要：
Calcium alloys - Chlorine compounds - Copper alloys - Electrodeposition
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