Research Status and Development Trend of Lock-in Infrared Thermography Detection of Material Subsurface / Surface Defects

被引：0
|
作者：
Wang, Huipeng [1 ]
Cai, Dongwei [1 ,2 ]
Dong, Lihong [2 ]
Lin, En [2 ,3 ]
Wang, Haidou [2 ,4 ]
机构：
[1] School of Mechanical and Electrical Engineering, Jiangxi University of Technology, Jiangxi, Ganzhou,341000, China
[2] National Key Laboratory for Remanufaeturing, Army Academy of Armored Forces, Beijing,100072, China
[3] School of Mechanical Engineering, Zhejiang University of Technology, Hangzhou,310023, China
[4] National Engineering Research Center for Remanufacture of Mechanical Products, Army Academy of Armored Forces, Beijing,100072, China
来源：
Cailiao Daobao/Materials Reports | 2024年 / 38卷 / 18期
基金：
中国国家自然科学基金;
关键词：
Effective detection of subsurface / surface defects of materials is an important guarantee to ensure the safety and reliability of structures. Lock-in infrared thermography is a branch of active infrared thermography. Because of its advantages of low heating excitation power intensity; insensitive to non-uniform heating and surface emissivity changes; it is widely used in defect detection such as subsurface delamination and debonding of materials. In recent years; with the deepening of research; lock-in infrared thermography has also proposed effective characterization methods for surface crack detection and depth quantification. Defect detection such as small; deep and irregular defects and defect detection in heterogeneous materials and complex structures have always been hot and difficult points in defect detection. Domestic and foreign scholars committed to proposing new defect characterization methods; reducing the influence of noise; transverse thermal diffusion and other factors on defect detection; and improving the ability of qualitative detection and quantitative characterization of defects. In this review; the research of domestic and foreign scholars is summarized from the perspectives of defect characterization extraction methods and detection of influencing factors; and the research of lock-in infrared thermography on the subsurface and surface defect detection of materials is summarized; and the prospect of lock-in infrared thermography is prospected. © 2024 Cailiao Daobaoshe/ Materials Review. All rights reserved;
D O I：
10.11896/cldb.23020112
中图分类号：
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