Permeable three-dimensional liquid metal integrated circuits reshaping the next generation of wearable electronics

被引：0
|
作者：
Zhu, Mengjia [1 ]
Zhang, Yingying [1 ]
机构：
[1] Tsinghua Univ, Dept Chem, Key Lab Organ Optoelect & Mol Engn, Minist Educ, Beijing 100084, Peoples R China
来源：
SCIENCE BULLETIN | 2024年 / 69卷 / 20期
基金：
中国国家自然科学基金;
关键词：
Compendex;
D O I：
10.1016/j.scib.2024.08.020
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
引用
收藏
页码：3169 / 3171
页数：3
相关论文
共 50 条
  • [41] Fast, automated thermal simulation of three-dimensional integrated circuits
    Wilkerson, P
    Raman, A
    Turowski, M
    ITHERM 2004, VOL 1, 2004, : 706 - 713
  • [42] Thermal Considerations for Monolithic Integration of Three-Dimensional Integrated Circuits
    Henning, A. K.
    Rajendran, B.
    Cronquist, B.
    Or-Bach, Z.
    2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2013,
  • [43] Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits
    Agrawal, Vishwani D.
    JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2012, 28 (01): : 1 - 1
  • [44] InP-based three-dimensional photonic integrated circuits
    Tsou, D
    Zaytsev, S
    Pauchard, A
    Hummel, S
    Lo, YH
    ADVANCES IN MICROELECTRONIC DEVICE TECHNOLOGY, 2001, 4600 : 10 - 13
  • [45] Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits
    Ma, Yu
    Jia, Dingcheng
    Gao, Wei
    Zhou, Pingqiang
    2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2019,
  • [46] Thermal Via Structural Design in Three-Dimensional Integrated Circuits
    Hwang, Leslie
    Lin, Kevin L.
    Wong, Martin D. F.
    2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 103 - 108
  • [47] Charged Device Model Reliability of Three-Dimensional Integrated Circuits
    Shukla, Vrashank
    Rosenbaum, Elyse
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2015, 15 (04) : 559 - 566
  • [48] Substrate Integrated Waveguide Directional Couplers for Compact Three-Dimensional Integrated Circuits
    Doghri, Ali
    Djerafi, Tarek
    Ghiotto, Anthony
    Wu, Ke
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (01) : 209 - 219
  • [49] Three-dimensional animations of power-electronics circuits visualize voltage and current
    Sullivan, CR
    PESC'03: 2003 IEEE 34TH ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2003, : 1210 - 1214
  • [50] Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics
    Kim, Minwoo
    Lim, Hyungjun
    Ko, Seung Hwan
    ADVANCED SCIENCE, 2023, 10 (06)
12345