Development of Fabrication Technology for Large 2.5D Packages

被引：0
|
作者：
Murai, Kosuke [1 ]
Hirano, Kazue [2 ]
Kang, Dongchul [2 ]
机构：
[1] Resonac Corporation, Electronics Business Headquarters, Laminate Materials R&D Department, 1919, Morisoejima, Ibaraki, Chikusei-shi,308-8521, Japan
[2] Resonac Corporation, Electronics Business Headquarters, Packaging Solution Center, AIRBIC 4F, 7-7 Shinkawasaki, Saiwai-ku, Kanagawa, Kawasaki-shi,212-0032, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2024年 / 27卷 / 05期
关键词：
D O I：
10.5104/jiep.27.375
中图分类号：
学科分类号：
摘要：
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收藏
页码：375 / 384
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