Control of 3D IC process steps by optical metrologies

被引:0
|
作者
Fresquet, G. [1 ]
Le Cunff, D. [2 ]
Raymond, Th. [3 ]
De Vries, D.K. [3 ]
机构
[1] Fogale Nanotech, France
[2] STMicroelectronics, France
[3] Qualtera, France
来源
Advancing Microelectronics | 2016年 / 43卷 / 02期
关键词
6;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:28 / 33
相关论文
共 50 条
  • [21] A Novel 3D IC Assembly Process for Ultra-Thin Chip Stacking
    Lin, Yu-Min
    Zhan, Chau-Jie
    Hsiao, Zhi-Cheng
    Fu, Huan-Chun
    Cheng, Ren-Shin
    Huang, Yu-Wei
    Huang, Shin-Yi
    Chen, Su-Mei
    Fan, Chia-Wen
    Chien, Chun-Hsien
    Ko, Cheng-Ta
    Guo, Yu-Huan
    Lee, Chang-Chun
    Tsutsumi, Yoshihiro
    Woo, Junsoo
    Suzuki, Yoshikazu
    Sato, Yusuke
    Liu, Chien-Ting
    Chao, Chih-Heng
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 470 - 474
  • [22] 3D Contactless communication for IC design
    Canegallo, Roberto
    Ciccarelli, Luca
    Natali, Federico
    Fazzi, Alberto
    Guerrieri, Roberto
    Rolandi, PierLuigi
    2008 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGS, 2008, : 241 - +
  • [23] 3D IC with TSV: Status and developments
    Vardaman, E. Jan
    SOLID STATE TECHNOLOGY, 2013, 56 (02) : 12 - 12
  • [24] Homogeneous Integration for 3D IC with TSV
    Kwai, Ding-Ming
    2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010), 2010, : 538 - 539
  • [25] 3D IC for future HEP detectors
    Thom, J.
    Lipton, R.
    Heintz, U.
    Johnson, M.
    Narain, M.
    Badman, R.
    Spiegel, L.
    Triphati, M.
    Deptuch, G.
    Kenney, C.
    Parker, S.
    Ye, Z.
    Siddons, D. P.
    JOURNAL OF INSTRUMENTATION, 2014, 9
  • [26] A Placement Optimization Technique for 3D IC
    Banerjee, Sabyasachee
    Majumder, Subhashis
    Varma, Abhishek
    Das, Debesh K.
    2017 7TH INTERNATIONAL SYMPOSIUM ON EMBEDDED COMPUTING AND SYSTEM DESIGN (ISED), 2017,
  • [27] 3D IC Integration Using Blockchain
    Radeep Krishna, R.
    Sivakumar, P.
    Abraham, C.G.
    Sreedivya, K.M.
    Lecture Notes in Networks and Systems, 2023, 540 : 317 - 344
  • [28] Mapping progress in 3D IC integration
    LoPiccolo, P
    SOLID STATE TECHNOLOGY, 2006, 49 (06) : 34 - +
  • [29] 3D IC系统架构概述
    陈昊
    谢业磊
    庞健
    欧阳可青
    中兴通讯技术, 2024, 30(S1) (S1) : 76 - 83
  • [30] Steps toward a relational 3D system
    Rosendahl, M
    CAD TOOLS AND ALGORITHMS FOR PRODUCT DESIGN, 2000, : 269 - 284