共 50 条
- [21] A Novel 3D IC Assembly Process for Ultra-Thin Chip Stacking 2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 470 - 474
- [22] 3D Contactless communication for IC design 2008 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGS, 2008, : 241 - +
- [24] Homogeneous Integration for 3D IC with TSV 2010 15TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2010), 2010, : 538 - 539
- [26] A Placement Optimization Technique for 3D IC 2017 7TH INTERNATIONAL SYMPOSIUM ON EMBEDDED COMPUTING AND SYSTEM DESIGN (ISED), 2017,
- [27] 3D IC Integration Using Blockchain Lecture Notes in Networks and Systems, 2023, 540 : 317 - 344
- [30] Steps toward a relational 3D system CAD TOOLS AND ALGORITHMS FOR PRODUCT DESIGN, 2000, : 269 - 284