3D Stacking Process Technologies for Advanced CMOS Image Sensors

被引：0
|
作者：
Iwamoto H. [1 ]
Kagawa Y. [1 ]
机构：
[1] Sony Semiconductor Solutions Corporation, 4-14-1 Asahi-cho, Kanagawa, Atsugi-shi
来源：
Journal of Japan Institute of Electronics Packaging | 2024年 / 27卷 / 01期
关键词：
D O I：
10.5104/jiep.27.163
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：163 / 168
页数：5
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