Influence of the key structures and the main process parameters on the etching property of chamber of wet etching machine

Taking the chamber of 18 inches wet etching machine as the research object, its numerical analysis model of coupled fluid and heat was established. The investigation on distribution law of process gas's flow rate, pressure and temperature in the chamber of wet etching machine during the etching process was developed. Based on the process principle of HF-acid etching SiO2 in ethanol environment, the evaluation method is put forward by the means of etching uniformity and etching speed, which were characterized by dissipation coefficient, material conversion factor, physical mass flux and the lattice structure common representation. The influence law of the key structure and main process parameters of the chamber on the etching rate and etching uniformity is obtained. ©, 2015, Chinese Ceramic Society. All right reserved.