Waveguide mechanism and design of thermal contact resistance at metal rheologic interface

被引:0
|
作者
Hu, Shi-Cheng [1 ]
Huang, Ming-Hui [1 ]
Li, Xiao-Qian [1 ]
Zhong, Jue [1 ]
机构
[1] Coll. of Mech. and Elec. Eng., Central South Univ., Changsha 410083, China
关键词
Free electron - Metal rheologic interface - Oxide film - Thermal contact resistance - Waveguide mechanism;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:579 / 584
相关论文
共 50 条
  • [21] INTERFACE THERMAL CONTACT RESISTANCE PROBLEM IN SPACE VEHICLES
    FRIED, E
    COSTELLO, FA
    ARS JOURNAL, 1962, 32 (02): : 237 - 243
  • [22] Evaluation of Thermal Contact Resistance at the Interface of Dissimilar Materials
    Fukuoka, Toshimichi
    Nomura, Masataka
    JOURNAL OF PRESSURE VESSEL TECHNOLOGY-TRANSACTIONS OF THE ASME, 2013, 135 (02):
  • [23] Thermal contact resistance at elastomer to metal interfaces
    Parihar, SK
    Wright, NT
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 1997, 24 (08) : 1083 - 1092
  • [24] Thermal conductivity and contact resistance of metal foams
    Sadeghi, E.
    Hsieh, S.
    Bahrami, M.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2011, 44 (12)
  • [25] On the electrical and thermal contact resistance of metal foam
    Fiedler, T.
    White, N.
    Dahari, M.
    Hooman, K.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 72 : 565 - 571
  • [26] Thermal conductivity and contact resistance of metal foams
    Department of Mechanical Engineering, University of Victoria, Victoria, BC V8W 3P6, Canada
    不详
    J Phys D, 12
  • [27] Thermal contact conductance of a coated paper/metal interface
    Noboa, HL
    Seyed-Yagoobi, J
    DRYING TECHNOLOGY, 2001, 19 (06) : 1125 - 1135
  • [28] Thermal contact resistance of cured gel polymeric thermal interface material
    Prasher, RS
    Matayabas, JC
    ITHERM 2004, VOL 1, 2004, : 28 - 35
  • [29] Thermal contact resistance of cured gel polymeric thermal interface material
    Prasher, RS
    Matayabas, JC
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (04): : 702 - 709
  • [30] Optimized design of thermal conductivity characteristics of contact interface for enhanced thermal contact properties
    Wang, Chen
    Yin, Kaiyang
    Hong, Jun
    Lin, Qiyin
    Yang, Chun
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2025, 240