E-beam patterning of hot-filament CVD fluorocarbon films using supercritical CO2 as a developer

被引：0
|
作者：
Pryce, H.G. [1 ]
Weibel, G.L. [1 ]
Ober, C.K. [1 ]
Gleason, K.K. [1 ]
机构：
[1] Department of Chemical Engineering, Massachusetts Institute of Technol., Cambridge, MA 02139, United States
来源：
Advanced Materials | 2001年 / 13卷 / 17期
关键词：
Carbon dioxide - Decomposition - Fourier transform infrared spectroscopy - Photoresists - Plasma enhanced chemical vapor deposition - Polytetrafluoroethylenes - Thin films - Wetting;
D O I：
10.1002/1521-4095(200102)13:33.0.CO;2-A
中图分类号：
学科分类号：
摘要：
Supercritical carbon dioxide as the development medium for patterning fluorocarbon films deposited by hot-filament CVD is described. It is shown that this direct dielectric patterning process represents a potential alternative to conventional lithography and wet development, and it may present a possible way of eliminating multiple steps presently required to produce patterned insulators.
引用
收藏
页码：195 / 197
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