E-beam patterning of hot-filament CVD fluorocarbon films using supercritical CO2 as a developer

被引：0

作者：

Pryce, H.G. ^{[1
]}

Weibel, G.L. ^{[1
]}

Ober, C.K. ^{[1
]}

Gleason, K.K. ^{[1
]}

机构：

[1] Department of Chemical Engineering, Massachusetts Institute of Technol., Cambridge, MA 02139, United States

来源：

Advanced Materials | 2001年 / 13卷 / 17期

关键词：

Carbon dioxide - Decomposition - Fourier transform infrared spectroscopy - Photoresists - Plasma enhanced chemical vapor deposition - Polytetrafluoroethylenes - Thin films - Wetting;

D O I：

10.1002/1521-4095(200102)13:33.0.CO;2-A

中图分类号：

学科分类号：

摘要：

Supercritical carbon dioxide as the development medium for patterning fluorocarbon films deposited by hot-filament CVD is described. It is shown that this direct dielectric patterning process represents a potential alternative to conventional lithography and wet development, and it may present a possible way of eliminating multiple steps presently required to produce patterned insulators.

引用

页码：195 / 197

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