Development of solver system for FEM analysis of solder joints

被引：0
|
作者：
Ohguchi K. [1 ]
机构：
[1] Faculty of Engineering and Resource Science, Akita University
来源：
Yosetsu Gakkai Shi/Journal of the Japan Welding Society | 2010年 / 79卷 / 03期
关键词：
D O I：
10.2207/jjws.79.215
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：11 / 15
页数：4
相关论文
共 50 条
  • [31] Integrity analysis of solder joints; Fracture mechanics approach
    Kim, DH
    Kang, KJ
    Earmme, YY
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 404 - 411
  • [32] An analysis case on the crack failure of CBGA solder joints
    Li, Weiming
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [33] FEM analysis on cyclic fatigue of ceramic/metal joints
    Huh, J.-W.
    Kobayashi, H.
    Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 1996, 62 (604): : 2669 - 2674
  • [34] Nondestructive Quantitative Analysis of Crack Propagation in Solder Joints
    Gershman, Israel
    Bernstein, Joseph B.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (08): : 1263 - 1270
  • [35] Microstructural development of Sn-Ag-Cu solder joints
    Fix, AR
    López, GA
    Brauer, I
    Nüchter, W
    Mittemeijer, EJ
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (02) : 137 - 142
  • [36] IGA-ADS: Isogeometric analysis FEM using ADS solver
    Los, Marcin M.
    Wozniak, Maciej
    Paszynski, Maciej
    Lenharth, Andrew
    Hassaan, Muhamm Amber
    Pingali, Keshav
    COMPUTER PHYSICS COMMUNICATIONS, 2017, 217 : 99 - 116
  • [37] Microstructural development of Sn-Ag-Cu solder joints
    Andreas R. Fix
    Gabriel A. López
    Ingo Brauer
    Wolfgang Nüchter
    Eric J. Mittemeijer
    Journal of Electronic Materials, 2005, 34 : 137 - 142
  • [38] GPU-ACCELERATED FEM SOLVER FOR THREE DIMENSIONAL ELECTROMAGNETIC ANALYSIS
    Tian Jin Gong Li* Shi Xiaowei Le Xu(National Key Laboratory of Science and Technology on Antennas and Microwaves
    Journal of Electronics(China), 2011, (Z1) : 615 - 622
  • [39] Development and application of a fast multipole method in a hybrid FEM/MoM field solver
    Guo, CL
    Hubing, TH
    APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY JOURNAL, 2004, 19 (03): : 126 - 134
  • [40] Dynamic mechanical behavior of SnAgCuBGA solder joints 5 determined by fast shear tests and FEM simulations
    Kaulfersch, Eberhard
    Rzepka, Sven
    Ganeshan, Vijay
    Mueller, Axel
    Michell, Bernd
    EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 172 - +
12345