Development of solver system for FEM analysis of solder joints

被引:0
|
作者
Ohguchi K. [1 ]
机构
[1] Faculty of Engineering and Resource Science, Akita University
关键词
D O I
10.2207/jjws.79.215
中图分类号
学科分类号
摘要
[No abstract available]
引用
收藏
页码:11 / 15
页数:4
相关论文
共 50 条
  • [21] FEM System Development for Dynamic Response Analysis of Acoustic Trim
    Kobayashi, Norimasa
    Habuchi, Masami
    Yamaoka, Hiroo
    SAE INTERNATIONAL JOURNAL OF PASSENGER CARS-MECHANICAL SYSTEMS, 2009, 2 (01): : 1487 - 1493
  • [22] Design of experiments and sensitivity analysis for electromigration on solder joints
    Zhang, Yuanxiang
    Liang, Lihua
    Liu, Yong
    Guti Lixue Xuebao/Acta Mechanica Solida Sinica, 2011, 32 (02): : 158 - 166
  • [23] ELASTOPLASTIC ANALYSIS OF SURFACE-MOUNT SOLDER JOINTS
    LAU, JH
    RICE, DW
    AVERY, PA
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (03): : 346 - 357
  • [24] STRENGTH ANALYSIS OF SOLDER JOINTS USED IN MICROELECTRONICS PACKAGING
    Wymyslowski, Artur
    Jankowski, Krystian
    EKSPLOATACJA I NIEZAWODNOSC-MAINTENANCE AND RELIABILITY, 2020, 22 (02): : 297 - 305
  • [25] Reliability Analysis of Pin-in-Hole Solder Joints
    Vianco, P. T.
    Neilsen, M. K.
    WELDING JOURNAL, 2015, 94 (11) : 56 - 61
  • [26] Sensitivity Analysis for the Dependence of Solder Joints Fatigue Life
    Hu, Weiwei
    Liu, Chenyan
    Sun, Yufeng
    Zhao, Guangyan
    2013 PROGNOSTICS AND HEALTH MANAGEMENT CONFERENCE (PHM), 2013, 33 : 553 - 558
  • [27] Durability analysis of SnAgCu solder joints for an aerospace application
    Lajimi, Amir M.
    Cugnoni, Joel
    Botsis, John
    WCECS 2008: ADVANCES IN ELECTRICAL AND ELECTRONICS ENGINEERING - IAENG SPECIAL EDITION OF THE WORLD CONGRESS ON ENGINEERING AND COMPUTER SCIENCE, PROCEEDINGS, 2009, : 131 - +
  • [28] Nanoindentation analysis of interfacial IMCs in electronic solder joints
    Shen, Yu-Lin
    Song, Jenn-Ming
    Su, Chien-Wei
    2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 88 - 90
  • [29] The FEM analysis and approximate model for cylindrical joints with clearances
    Liu, Cai-Shan
    Zhang, Ke
    Yang, Rei
    MECHANISM AND MACHINE THEORY, 2007, 42 (02) : 183 - 197
  • [30] Analysis of the influence of dispensing on the reliability of CCGA solder joints
    Chen, Xiaodong
    Zou, Yabing
    Lu, Tao
    He, Xiao
    Liu, Jiahao
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,