Technology comparisons and the economics of flip chip packaging

被引：0
|
作者：
Prasad, S. [1 ]
Sathyanarayan, S. [1 ]
机构：
[1] APT Interactive, 235, 40th Cross, 5th Block, Jayanagar, Bangalore 560 041, India
来源：
Solid State Technology | 2001年 / 44卷 / 3 SUPPL.期
关键词：
Electric wire - Electronics packaging - Integrated circuit layout;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The decision to use flip chip packaging is not a simple one. Many equipment, product, and process variables affect the relative merits of flip chip vs. wire bonded packages. A detailed analysis of all of these factors can help to guide the decision and clarify the effects of the variables on the cost of different packaging approaches.
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