Reducing costs for TSV manufacturing

被引：0
|
作者：
Cook, Kathy [1 ,2 ]
机构：
[1] SUSS MicroTec
[2] SUSS MicroTec, Inc., 228 Suss Dr., Waterbury Center, VT 05677, United States
来源：
Advanced Packaging | 2008年 / 17卷 / 08期
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页码：24 / 27
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