Reducing costs for TSV manufacturing

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|

作者：

Cook, Kathy ^{[1
,2
]}

机构：

[1] SUSS MicroTec

[2] SUSS MicroTec, Inc., 228 Suss Dr., Waterbury Center, VT 05677, United States

来源：

Advanced Packaging | 2008年 / 17卷 / 08期

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页码：24 / 27

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