Electroplating of Al-Ti and Ti in room temperature melt

被引：0

作者：

Takenaka, Toshihide ^{[1
]}

Kawakami, Masahiro ^{[1
]}

机构：

[1] Dept. of Production Systems Eng., Toyohashi University of Technology, Hibarigaoka 1-1, Tempaku-cho, Toyohashi 441-8580, Japan

来源：

International Journal of Materials and Product Technology | 2001年 / SPEC ISS. VOL.2期

关键词：

Aluminum alloys - Cathodes - Intermetallics - Molten materials - Salts - Surface structure - Titanium;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Electroplating of Al-Ti alloy in AlCl3-BPC (n-butylpyridinium-chloride) melts containing TICln (n=2,3,4) has been studied at 300∼450K. The cathode surface was covered with a smooth and dense metallic layer which consisted of mainly Al and included Ti. The surface became uneven with the increase in Ti content in the deposit. Intermetallic compounds of Al and Ti were not detected even in the deposit containing Ti more than 10 at%. Electrolysis in TICln (n=2,3,4)-BPC melts has been tested above the melting point of BPC (∼405K). Metallic electrodeposit was not obtained under any condition in these melts.

引用

页码：500 / 505

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