Application of a force sensor in wire bonding process

被引：0
|
作者：
Zhou, Lei [1 ]
Li, Jiangang [1 ]
Fu, Lanhui [1 ]
Li, Zexiang [2 ]
机构：
[1] Department of Control and Mechatronics Engineering, Shenzhen Graduate School Harbin Institute of Technology, Shenzhen, 518055, China
[2] Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong, 999077, China
来源：
Sensors and Transducers | 2013年 / 159卷 / 11期
关键词：
Wire - Force control;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：345 / 350
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