Investigation of microstructure and mechanical properties of Sn-xCu solder alloys

被引：0
|
作者：
机构：
[1] [1,Abd El-Rehim, A.F.
[2] 1,Zahran, H.Y.
来源：
Abd El-Rehim, A.F. (alaa.abdelrehim@kku.edu.sa) | 1600年 / Elsevier Ltd卷 / 695期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF AS-CAST Sn-Sb-Zn LEAD FREE SOLDER ALLOYS
    Mladenovic, Srba
    Markovic, Desimir
    Ivanic, Ljubica
    Ivanov, Svetlana
    Guskovic, Dragoslav
    METALURGIA INTERNATIONAL, 2012, 17 (04): : 34 - 38
  • [22] Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
    Noh, Bo-In
    Choi, Jung-Hyun
    Yoon, Jeong-Won
    Jung, Seung-Boo
    JOURNAL OF ALLOYS AND COMPOUNDS, 2010, 499 (02) : 154 - 159
  • [23] Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
    C. M. L. Wu
    D. Q. Yu
    C. M. T. Law
    L. Wang
    Journal of Electronic Materials, 2002, 31 : 928 - 932
  • [24] Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
    Wu, CML
    Yu, DQ
    Law, CMT
    Wang, L
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (09) : 928 - 932
  • [25] Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
    Osorio, Wislei R.
    Peixoto, Leandro C.
    Garcia, Leonardo R.
    Mangelinck-Noel, Nathalie
    Garcia, Amauri
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 572 : 97 - 106
  • [26] Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
    Osório, W.R. (wislei.osorio@fca.unicamp.br), 1600, Elsevier Ltd (572):
  • [27] Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys
    Chen, Sheng
    Wang, Xinbao
    Guo, Zhiqiu
    Wu, Changjun
    Liu, Yongxiong
    Liu, Ya
    Su, Xuping
    COATINGS, 2023, 13 (02)
  • [28] Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints
    Guo, Qinhan
    Zhao, Zhenjiang
    Shen, Chunlong
    MICROELECTRONICS RELIABILITY, 2017, 78 : 72 - 79
  • [29] An investigation of microstructure and mechanical properties in Cu-Ti-Sn alloys rich in copper
    Lebreton, V.
    Pachoutinski, D.
    Bienvenu, Y.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 508 (1-2): : 83 - 92
  • [30] Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering
    Zhao Ning
    Deng Jianfeng
    Zhong Yi
    Yin Luqiao
    ACTA METALLURGICA SINICA, 2017, 53 (07) : 861 - 868
12345