Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints

被引：10
|
作者：
Guo, Qinhan [1 ]
Zhao, Zhenjiang [1 ]
Shen, Chunlong [1 ]
机构：
[1] Taizhou Univ, Sch Shipping & Mechatron Engn, Taizhou 225300, Jiangsu, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2017年 / 78卷
关键词：
Sn-10Bi; Sn-Ag-Cu; Strength; Creep; Bending; Fracture mode; CREEP-BEHAVIOR; RELIABILITY; STRENGTH; GROWTH; BI;
D O I：
10.1016/j.microrel.2017.08.004
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The comparison study of Sn-10Bi and Sn-3.0Ag-0.5Cu solder alloys and joints was conducted. The results showed that the liquidus of Sn-10Bi solder alloy was lower than that of Sn-Ag-Cu slightly. The interfacial IMCs layer growth of Sn-10Bi/Cu was slower than that of Sn-Ag-Cu/Cu during liquid/solid reaction. The higher strength and lower creep strain rate of Sn-10Bi comparing with that of Sn-Ag-Cu were contributed by the solid solution strengthening effect of Bi atom in beta-Sn phase. The ultimate bending load of Sn-10Bi joint was higher than that of Sn-Ag-Cu joint as the high strength of Sn-10Bi solder alloy. Moreover, the thinner and more flat IMCs layer also ensured the stable maximum bending displacement of Sn-10Bi joint at a loading speed of 1 mm/s compared with that of Sn-Ag-Cu joint. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码：72 / 79
页数：8
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