3d hot-spot localization by lock-in thermography

被引：0
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作者：
Brand, Sebastian [1 ]
Altmann, Frank [1 ]
机构：
[1] Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
来源：
Electronic Device Failure Analysis | 2020年 / 22卷 / 02期
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页码：29 / 35
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