Device-level packaging for optical integration

被引：0

作者：

Lecarpentier, Gilbert ^{[1
]}

Racz, Livia ^{[1
]}

机构：

[1] AXSUN Technologies, 1 Fortune Dr., Billerica, MA 01821, United States

来源：

Advanced Packaging | 2003年 / 12卷 / 01期

关键词：

Costs - Fiber optic networks - Lithography - Optical systems - Optoelectronic devices;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A report is presented on the device-level packaging for optical integration. Recently developed platforms make it feasible to align any combination of active and passive devices within a single component-sized footprint. Such approaches allow telecom system manufacturers to get high-performance and high-quality devices at a reasonable price.

引用

页码：17 / 19

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