Improving stencil printing results

被引：0
|
作者：
Miller-Short, Rachel [1 ]
机构：
[1] Photo Stencil LLC, United States
来源：
SMT Surface Mount Technology Magazine | 2014年 / 29卷 / 09期
关键词：
Printing presses;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：68 / 72
相关论文
共 50 条
  • [21] Optimizing stencil printing parameters for organic materials
    Jiang, TB
    Ahmad, SS
    Jesse, C
    Moden, W
    TWENTY FIRST IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1997, : 68 - 72
  • [22] Characterization of the solder paste release from small stencil apertures in the stencil printing process
    Aravamudhan, S
    Santos, D
    Pham-Van-Diep, G
    Andres, F
    JOURNAL OF ELECTRONIC PACKAGING, 2005, 127 (03) : 340 - 352
  • [23] Modelling the effect of uneven PWB surface on stencil bending during stencil printing process
    Krammer, Oliver
    Molnar, Laszlo Milan
    Jakab, Laszlo
    Szabo, Andras
    MICROELECTRONICS RELIABILITY, 2012, 52 (01) : 235 - 240
  • [24] Use of electrospun fiber membrane as the screen printing stencil for high definition printing
    Zhang, Teng
    Mu, Xiaoqing
    Jiang, Ming
    Huang, Leping
    Zhao, Jinchao
    MATERIALS RESEARCH EXPRESS, 2019, 6 (11)
  • [25] Evaluation of process parameters for flip chip stencil printing
    Nguty, TA
    Riedlin, MHA
    Ekere, NN
    TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 206 - 216
  • [26] ROLE OF THE STENCIL IN HIGH DEFINITION SCREEN PRINTING.
    Partridge, S.A.
    Circuit World, 1987, 13 (02) : 4 - 13
  • [27] Stencil printing holds high promise for wafer bumping
    Roberts, J
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 454 - 459
  • [28] Taguchi design of experiment for wafer bumping by stencil printing
    Lau, J
    Chang, C
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1705 - 1711
  • [29] Taguchi design of experiment for wafer bumping by stencil printing
    Lau, JH
    Chang, C
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (03): : 219 - 225
  • [30] Modeling and optimization of stencil printing operations: A comparison study
    Tsai, Tsung-Nan
    COMPUTERS & INDUSTRIAL ENGINEERING, 2008, 54 (03) : 374 - 389
12345