Application of the wire bonding technology to a flexible neural probe

被引：0
|
作者：
Shimizu, Koichi [1 ]
Nakanishi, Motofumi [1 ]
Makikawa, Masaaki [1 ]
Asajima, Syuzo [2 ]
Konishi, Satoshi [1 ]
机构：
[1] Ritsumeikan University, 1-1-1 Noji-higashi, Kusatsu, Shiga 525-8577, Japan
[2] Shiga University of Medical Science, Seta, Tsukinowa-cho, Otsu City 520-2192, Japan
来源：
IEEJ Transactions on Sensors and Micromachines | 2009年 / 129卷 / 11期
关键词：
D O I：
10.1541/ieejsmas.129.387
中图分类号：
学科分类号：
摘要：
16
引用
收藏
页码：387 / 392
相关论文
共 50 条
  • [1] DEVELOPMENT OF COPPER WIRE BONDING APPLICATION TECHNOLOGY
    TOYOZAWA, K
    FUJITA, K
    MINAMIDE, S
    MAEDA, T
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04): : 667 - 672
  • [2] Advanced Wire Bonding Technology for Ag Wire
    Shah, Aashish
    Rockey, Thomas
    Xu, Hui
    Qin, Ivy
    Jie, Wu
    Yauw, Oranna
    Chylak, Bob
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [3] Plasma Cleaning and Its application in Microwave Module Wire Bonding Technology
    Han Zongjie
    Yan Wei
    Hu Yongfang
    Li Xiaoxuan
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 360 - 362
  • [4] Flexible Optoelectric Neural Interface Integrated Wire-Bonding μLEDs and Microelectrocorticography for Optogenetics
    Ji, Bowen
    Wang, Minghao
    Kang, Xiaoyang
    Gu, Xiaowei
    Li, Chengyu
    Yang, Bin
    Wang, Xiaolin
    Liu, Jingquan
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (05) : 2008 - 2015
  • [5] FLEXIBLE APPROACH TO AUTOMATED WIRE BONDING.
    Stubin, R.J.
    Dieffenbacher, George W.
    Electronic Packaging and Production, 1981, 21 (01): : 113 - 128
  • [6] Progress and perspective of wire bonding technology
    Sakakura M.
    Journal of Japan Institute of Electronics Packaging, 2019, 22 (05) : 422 - 426
  • [7] PRACTICAL TECHNOLOGY OF COPPER WIRE BONDING
    TOYOZAWA, K
    OOMI, S
    MINAMIDE, S
    WAKAMOTO, S
    MAEDA, T
    SHARP TECHNICAL JOURNAL, 1989, (42): : 77 - 80
  • [8] Copper Wire Bonding - A Maturing Technology
    Appelt, Bernd K.
    Tseng, Andy
    Lai, Yi-Shao
    Chen, Chun-Hsiung
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 479 - 483
  • [9] DEVELOPMENT OF A COATED WIRE BONDING TECHNOLOGY
    OKIKAWA, S
    TANIMOTO, M
    WATANABE, H
    MIKINO, H
    KANEDA, T
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04): : 603 - 608
  • [10] Novel enabling wire bonding technology
    Ruiz, A.
    Vega, E.
    Katiyar, R.
    Valentin, R.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 458 - +
12345