Detection of subsurface damage and material removal mechanism in optical polishing process

被引：0
|
作者：
Wang, Zhuo [1 ]
Wu, Yu-Lie [1 ]
Dai, Yi-Fan [1 ]
Li, Sheng-Yi [1 ]
Lu, De-Feng [2 ]
Xu, Hui-Yun [2 ]
机构：
[1] College of Mechatronics Engineering and Automation, National Univ. of Defence Technology, Changsha 410073, China
[2] SAE Technologies Development Co. Ltd, Dongguan 523000, China
来源：
Guofang Keji Daxue Xuebao/Journal of National University of Defense Technology | 2009年 / 31卷 / 02期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Polishing
引用
收藏
页码：107 / 111
相关论文
共 50 条
  • [41] Local material removal mechanism considering curvature effect in the polishing process of the small aspherical lens die
    Yang, MY
    Lee, HC
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2001, 116 (2-3) : 298 - 304
  • [42] Characterization of subsurface damage of optical materials in lapping process
    College of Mechatronic Engineering and Automation, National University of Defence Technology, Changsha 410073, China
    Nami Jishu yu Jingmi Gongcheng, 2008, 5 (349-355):
  • [43] Analysis of subsurface damage during fabrication process and its removal
    Xiao, Kun
    Bao, Lei
    Wang, Wei
    Zhu, Jianqiang
    PACIFIC RIM LASER DAMAGE 2011: OPTICAL MATERIALS FOR HIGH POWER LASERS, 2012, 8206
  • [44] Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals
    Zhang, Xiaoyu
    Guo, Xingchen
    Wang, Haoxiang
    Kang, Renke
    Gao, Shang
    LANGMUIR, 2023, 39 (38) : 13668 - 13677
  • [45] Study on Material Removal Mechanism and Damage Evolution of Monocrystalline Gallium Oxide in Grinding Process
    Yang X.
    Kang R.
    Ren J.
    Li T.
    Gao S.
    Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences, 2024, 51 (04): : 10 - 19
  • [46] A review of subsurface damage detection methods for optical components
    Cui, Yana
    Wang, Chunyang
    Liu, Xuelian
    Wu, Yajie
    Li, Zhengze
    Li, Rong
    He, Wen
    AIP ADVANCES, 2023, 13 (06)
  • [47] Machining performance and material removal mechanism of sapphire with novel polishing slurry
    Xu, Yongchao
    Peng, Cheng
    Zhan, Youji
    Wang, Qianting
    APPLIED SURFACE SCIENCE, 2024, 671
  • [48] Origin of material removal mechanism in shear thickening-chemical polishing
    Li, Min
    Liu, Minghui
    Riemer, Oltmann
    Karpuschewski, Bernhard
    Tang, Cheng
    INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2021, 170
  • [49] Material removal mechanism of ceria particles with different sizes in glass polishing
    Peng, Wenqiang
    Guan, Chaoliang
    Li, Shengyi
    OPTICAL ENGINEERING, 2014, 53 (03)
  • [50] Research on the molecular scale material removal mechanism in chemical mechanical polishing
    WANG YongGuang & ZHAO YongWu School of Mechanical Engineering
    Chinese Science Bulletin, 2008, (13) : 2084 - 2089
12345