Detection of subsurface damage and material removal mechanism in optical polishing process

被引：0
|
作者：
Wang, Zhuo [1 ]
Wu, Yu-Lie [1 ]
Dai, Yi-Fan [1 ]
Li, Sheng-Yi [1 ]
Lu, De-Feng [2 ]
Xu, Hui-Yun [2 ]
机构：
[1] College of Mechatronics Engineering and Automation, National Univ. of Defence Technology, Changsha 410073, China
[2] SAE Technologies Development Co. Ltd, Dongguan 523000, China
来源：
Guofang Keji Daxue Xuebao/Journal of National University of Defense Technology | 2009年 / 31卷 / 02期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Polishing
引用
收藏
页码：107 / 111
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