Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles

被引：0
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作者：
Yakymovych, Andriy [1 ,2 ]
Plevachuk, Yuriy [3 ]
Orovcik, Lubomir [4 ]
Švec Sr, Peter [5 ]
机构：
[1] Dr. Oswin-Moro-Srt. 19, Villach,9500, Austria
[2] Department of Inorganic Chemistry-Functional Materials, Faculty of Chemistry, University of Vienna, Althanstr. 14, Vienna,1090, Austria
[3] Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo and Mefodiy St. 8, Lviv,79005, Ukraine
[4] Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84513, Slovakia
[5] Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84511, Slovakia
来源：
Applied Nanoscience (Switzerland) | 2022年 / 12卷 / 04期
关键词：
Intermetallics - Copper alloys - Lead-free solders - Morphology - Nickel - Growth kinetics - Tin alloys - Nanocomposites - Binary alloys;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：977 / 982
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