Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles

被引：0
|
作者：
Yakymovych, Andriy [1 ,2 ]
Plevachuk, Yuriy [3 ]
Orovcik, Lubomir [4 ]
Švec Sr, Peter [5 ]
机构：
[1] Dr. Oswin-Moro-Srt. 19, Villach,9500, Austria
[2] Department of Inorganic Chemistry-Functional Materials, Faculty of Chemistry, University of Vienna, Althanstr. 14, Vienna,1090, Austria
[3] Department of Metal Physics, Ivan Franko National University of Lviv, Kyrylo and Mefodiy St. 8, Lviv,79005, Ukraine
[4] Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84513, Slovakia
[5] Institute of Physics, Slovak Academy of Sciences, Dubravska cesta 9, Bratislava,84511, Slovakia
来源：
Applied Nanoscience (Switzerland) | 2022年 / 12卷 / 04期
关键词：
Intermetallics - Copper alloys - Lead-free solders - Morphology - Nickel - Growth kinetics - Tin alloys - Nanocomposites - Binary alloys;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：977 / 982
相关论文
共 50 条
  • [21] Electric current-assisted creep behaviour of Sn–3.0Ag–0.5Cu solder
    Xu Long
    Wenbin Tang
    Mengfei Xu
    Leon M. Keer
    Yao Yao
    Journal of Materials Science, 2018, 53 : 6219 - 6229
  • [22] Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density
    Yubing Gong
    Longgen Liu
    Siliang He
    Haidong Yan
    Wangyun Li
    Hongbo Qin
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 24906 - 24919
  • [23] Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing
    Kim, Jungsoo (kjs207@kitech.re.kr); Yoon, Jeong-Won (jwyoon@chungbuk.ac.kr), 1600, Elsevier Ltd (850):
  • [24] Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0Ag–0.5Cu solder as barrier
    Fengjiang Wang
    Dongyang Li
    Zhijie Zhang
    Mingfang Wu
    Chao Yan
    Journal of Materials Science: Materials in Electronics, 2017, 28 : 19051 - 19060
  • [25] Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging
    Jong-Hoon Back
    Jeong-Won Yoon
    Journal of Materials Science: Materials in Electronics, 2021, 32 : 24790 - 24800
  • [26] Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic
    Shuye Zhang
    Bingxuan Zhu
    Xiang Zhou
    Xingxing Wang
    Tiesong Lin
    Peng He
    Kyung-Wook Paik
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 17972 - 17985
  • [27] Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder
    Soonyong Kwon
    Hoo-Jeong Lee
    Sehoon Yoo
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 8493 - 8501
  • [28] Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging
    Wei-Yu Chen
    Chi-Yang Yu
    Jenq-Gong Duh
    Journal of Materials Science, 2012, 47 : 4012 - 4018
  • [29] Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging
    Jun Shen
    Qin Tang
    Yayun Pu
    Dajun Zhai
    Zhongming Cao
    Jie Chen
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 4881 - 4887
  • [30] Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets
    Huang, Yilong
    Xiu, Ziyang
    Wu, Gaohui
    Tian, Yanhong
    He, Peng
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (07) : 6809 - 6815
12345