Process optimization in glass wafer cut-off grinding - Cut-off grinding with direct substrate fixation on cutting foils to save costs and time

被引：0
|
作者：
Jahnel K. [1 ]
Maier W. [2 ]
Wilhelm D.P. [1 ]
Hähnel S. [1 ]
Grunwald T. [1 ]
Bergs T. [1 ]
机构：
[1] Fraunhofer-Institut für Produktionstechnologie IPT, Steinbachstr. 17, Aachen
[2] Ingeneric GmbH, Zum Carl-Alexander-Park 7, Baesweile
来源：
WT Werkstattstechnik | 2023年 / 113卷 / 06期
关键词：
Fertigungstechnik; Schleifen; Spanntechnik;
D O I：
10.37544/1436-4980-2023-06-41
中图分类号：
学科分类号：
摘要：
Fast Axis Collimators (FAC) are essential optical elements for diode laser systems. The increasing number of damages occurring in the current process of cut-off grinding with downstream cleaning of FAC optics made of pressed anti-reflective coated glass wafers limits the use of optics in high-power applications. Using cutting film for substrate fixation during cut-off grinding of FAC optics allows for defect-free cutting and clean release from the cutting film while saving costs and production time. © 2023, VDI Fachmedien GmBH & Co. KG. All rights reserved.
引用
收藏
页码：249 / 254
页数：5
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