Lead-Free Conductors with a Surface Treatment Ensuring a Low Melting Temperature

被引:0
|
作者
Mareška A. [1 ]
Kordová T. [1 ]
Míka M.H. [1 ]
机构
[1] Department of Glass and Ceramics, Faculty of Chemical Technology, University of Chemistry and Technology, Technická 5, Dejvice, Prague
来源
关键词
coating; conductors; environment; lead-free soldering; tin;
D O I
10.3311/PPtr.22876
中图分类号
学科分类号
摘要
In order to protect the environment and to ensure sustainability, it is prohibited to use lead materials in the production of automotive components. As part of soldering, busbars are used that usually have a copper core and a coating made of tin, but the melting point of such material is high, which poses a problem during soldering. This article discusses the case where a busbar is interconnected with another conductor in a sealable pressure vessel where high temperatures and pressures are reached. The product is heated to a certain temperature and the melting temperature of the given bus coating is exceeded, resulting in soldering and an ideal connection of the wires. The problem is that the temperatures reached by the processor during this operation are lower than the melting temperatures of the busbar with a tin coating. In the article, the authors focus on the production and development of new types of busbars with a coating consisting of tin, bismuth and indium and discuss possible formulations and their effect on the melting temperature of the busbars. © 2024 Budapest University of Technology and Economics. All rights reserved.
引用
收藏
页码:134 / 141
页数:7
相关论文
共 50 条
  • [31] The Activator Optimization of Low-temperature SnBi Lead-free Solder Paste
    Jiang, Yan
    Shan, Ke
    Sun, Li-da
    Li, Zi-jing
    Xiao, Rui-ming
    PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MATERIALS, ENVIRONMENTAL AND BIOLOGICAL ENGINEERING, 2015, 10 : 877 - 880
  • [32] High temperature lead-free attach reliability
    McCluskey, Patrick
    Quintero, Pedro O.
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, : 93 - 98
  • [33] High temperature lead-free solder for microelectronics
    Gayle, FW
    Becka, G
    Badgett, J
    Whitten, G
    Pan, TY
    Grusd, A
    Bauer, B
    Lathrop, R
    Slattery, J
    Anderson, I
    Foley, J
    Gickler, A
    Napp, D
    Mather, J
    Olson, C
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06): : 17 - 21
  • [34] High temperature lead-free solder for microelectronics
    Frank W. Gayle
    Gary Becka
    Ahmer Syed
    Jerry Badgett
    Gordon Whitten
    Tsung-Yu Pan
    Angela Grusd
    Brian Bauer
    Rick Lathrop
    Jim Slattery
    Iver Anderson
    Jim Foley
    Alan Gickler
    Duane Napp
    John Mather
    Chris Olson
    JOM, 2001, 53 : 17 - 21
  • [35] High temperature lead-free solder for microelectronics
    Gayle, FW
    Syed, A
    Badgett, J
    Whitten, G
    Pan, TY
    Grusd, A
    Bauer, B
    Lathrop, R
    Slattery, J
    Anderson, I
    Foley, J
    Gickler, A
    Napp, D
    Mather, J
    Olson, C
    Becka, G
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1019 - 1022
  • [36] Liquidus temperature design of lead-free solder
    Suetsugu, Kenichiro
    Furusawa, Akio
    Tanaka, Masato
    Takano, Hiroaki
    Takehara, Hideki
    Horiuchi, Toshihiro
    Matsushige, Kazumi
    MATERIALS TRANSACTIONS, 2006, 47 (04) : 1082 - 1089
  • [37] Solderability of lead-free surface finished PCB
    Harant, Petr
    Steiner, Frantisek
    2007 30TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2007, : 388 - 392
  • [38] Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
    Zou, C. D.
    Gao, Y. L.
    Yang, B.
    Zhai, Q. J.
    Andersson, C.
    Liu, J.
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2009, 21 (02) : 9 - 13
  • [39] Low warpage, lead-free multilayer dielectric
    Tanaka, T
    Kris, EM
    1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 328 - 332
  • [40] Effect of Al and Bi addition on the corrosion behaviour, hardness, and melting temperature of lead-free solder alloys
    Abd El Hamid, Sh. E.
    Gouda, El Said
    Ghany, Nabil A. Abdel
    MICROELECTRONICS RELIABILITY, 2023, 147