The Activator Optimization of Low-temperature SnBi Lead-free Solder Paste

被引：0
|
作者：
Jiang, Yan [1 ]
Shan, Ke [1 ]
Sun, Li-da [1 ]
Li, Zi-jing [1 ]
Xiao, Rui-ming [1 ]
机构：
[1] HongHe Univ, Coll Sci, Mengzi 661100, Yunnan, Peoples R China
来源：
PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MATERIALS, ENVIRONMENTAL AND BIOLOGICAL ENGINEERING | 2015年 / 10卷
关键词：
Lead-free solder paste; activator; performance;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The optimization of activator used in SnBi lead-free solder paste were carried out by welding experiments with the spreadability and the spot morphology as the main comment indexes. And the properties of the composite activator which was mixed by two activator possessing good performances were studied. The results indicated that the pastes with succinic acid and salicylic acid for as single activator have low wettability, the surface is easily oxidized; When (succinic acid : salicylic acid) is 2: 3, the solder paste has good weldability and the spreadabilities are 83%. The appearance of spots is regular, plump, beamy and less surface oxide.
引用
收藏
页码：877 / 880
页数：4
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