The synergistic effects of additives on the micro vias copper filling

被引：0
|
作者：
Tao, Zhihua [1 ]
Long, Zhiyuan [1 ]
Tengxu, Linjie [1 ]
Liu, Guanting [1 ]
Tao, Xuefei [2 ]
机构：
[1] School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu,610054, China
[2] Jiangxi Vocational College of Finance and Economics, Jiujiang,332000, China
来源：
Journal of Electroanalytical Chemistry | 2022年 / 918卷
关键词：
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摘要：
Electroplating
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