Mechanical-electric-magnetic-thermal coupled enriched finite element method for magneto-electro-elastic structures

被引:0
|
作者
Zhou, Liming [1 ,2 ,3 ]
Chen, Pengxu [2 ]
Gao, Yan [2 ]
Wang, Jiye [2 ]
机构
[1] Jilin Univ, Key Lab CNC Equipment Reliabil, Minist Educ, Changchun 130025, Jilin, Peoples R China
[2] Jilin Univ, Sch Mech & Aerosp Engn, Changchun 130025, Jilin, Peoples R China
[3] Jilin Univ, Natl Key Lab Automot Chassis Integrat & B, Changchun, Jilin, Peoples R China
关键词
MEE structures; mechanical-electric-magnetic-thermal coupled enriched finite element method; interpolation coverage function; generalized displacement shape function; mechanical characteristic; POINT INTERPOLATION METHOD; DYNAMIC-ANALYSIS; INTERFACE CRACK; STATIC ANALYSIS; VIBRATION; PLATES; MODEL;
D O I
10.1088/1361-651X/ad747c
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Magneto-electro-elastic (MEE) materials possess the ability to convert mechanical, electrical, and magnetic energies, playing a critical role in smart devices. To improve the accuracy and efficiency of solving the mechanical properties of MEE structures in mechanical-electrical-magnetic-thermal (MEMT) environments, an MEMT coupled multiphysics enriched finite element method (MP-EFEM) is proposed. Based on the fundamental equations and boundary conditions of MEE materials, the interpolation coverage function is introduced into the MEMT coupled finite element method (FEM) to construct higher-order approximate interpolation displacement shape functions, electric potential shape functions, and magnetic potential shape functions. Combined with the variational principle, MP-EFEM is proposed, and the governing equations of MP-EFEM are derived. Numerical examples validate the accuracy and high efficiency of MP-EFEM in solving the mechanical properties of MEE structures in MEMT environments. When compared to the MEMT coupled FEM (MEMT-FEM), the results show that this method offers higher accuracy and efficiency. Therefore, MP-EFEM can effectively analyze the mechanical properties of MEE structures under multiphysics coupling, providing a new method for the design and development of smart devices.
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页数:26
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