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Mechanical-electric-magnetic-thermal coupled enriched finite element method for magneto-electro-elastic structures
被引:0
|作者:
Zhou, Liming
[1
,2
,3
]
Chen, Pengxu
[2
]
Gao, Yan
[2
]
Wang, Jiye
[2
]
机构:
[1] Jilin Univ, Key Lab CNC Equipment Reliabil, Minist Educ, Changchun 130025, Jilin, Peoples R China
[2] Jilin Univ, Sch Mech & Aerosp Engn, Changchun 130025, Jilin, Peoples R China
[3] Jilin Univ, Natl Key Lab Automot Chassis Integrat & B, Changchun, Jilin, Peoples R China
关键词:
MEE structures;
mechanical-electric-magnetic-thermal coupled enriched finite element method;
interpolation coverage function;
generalized displacement shape function;
mechanical characteristic;
POINT INTERPOLATION METHOD;
DYNAMIC-ANALYSIS;
INTERFACE CRACK;
STATIC ANALYSIS;
VIBRATION;
PLATES;
MODEL;
D O I:
10.1088/1361-651X/ad747c
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
Magneto-electro-elastic (MEE) materials possess the ability to convert mechanical, electrical, and magnetic energies, playing a critical role in smart devices. To improve the accuracy and efficiency of solving the mechanical properties of MEE structures in mechanical-electrical-magnetic-thermal (MEMT) environments, an MEMT coupled multiphysics enriched finite element method (MP-EFEM) is proposed. Based on the fundamental equations and boundary conditions of MEE materials, the interpolation coverage function is introduced into the MEMT coupled finite element method (FEM) to construct higher-order approximate interpolation displacement shape functions, electric potential shape functions, and magnetic potential shape functions. Combined with the variational principle, MP-EFEM is proposed, and the governing equations of MP-EFEM are derived. Numerical examples validate the accuracy and high efficiency of MP-EFEM in solving the mechanical properties of MEE structures in MEMT environments. When compared to the MEMT coupled FEM (MEMT-FEM), the results show that this method offers higher accuracy and efficiency. Therefore, MP-EFEM can effectively analyze the mechanical properties of MEE structures under multiphysics coupling, providing a new method for the design and development of smart devices.
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页数:26
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