High-speed 2D materials inspection using a microscopic dynamic spectroscopic imaging ellipsometer

被引:0
|
作者
Choi, Sukhyun [1 ,2 ]
Woo, Chae Young [3 ]
Hwang, Gukhyeon [1 ]
Kheiryzadehkhanghah, Saeid [1 ]
Choi, Inho [1 ]
Cho, Yong Jai [2 ]
Lee, Hyung Woo [3 ,4 ,5 ]
Chegal, Won [2 ,6 ]
Kim, Daesuk [1 ]
机构
[1] Jeonbuk Natl Univ, Dept Mech Syst Engn, Jeonju 54896, South Korea
[2] Korea Res Inst Stand & Sci, Semicond Integrated Metrol Team, Daejeon 34113, South Korea
[3] Pusan Natl Univ, Dept Nano Fus Technol, Busan 46241, South Korea
[4] Pusan Natl Univ, Dept Nanoenergy Engn, Busan 46241, South Korea
[5] Pusan Natl Univ, Res Ctr Energy Convergence Technol, Busan 46241, South Korea
[6] Chungnam Natl Univ, Grad Sch Analyt Sci & Technol GRAST, Daejeon 34134, South Korea
基金
新加坡国家研究基金会;
关键词
THICKNESS; GRAPHENE; ELECTRONICS;
D O I
10.1364/AO.527455
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We describe a high-speed two-dimensional (2D) materials inspection method by using a microscopic dynamic spectroscopic imaging ellipsometer. This system employs a high-numerical-aperture (NA) objective telecentric lens module. Unlike conventional spectroscopic imaging ellipsometers, which require relatively long acquisition times due to rotating polarization elements, our proposed system uses a monolithic polarizing interferometric module. This allows it to extract a spatio-spectral ellipsometric phase map A(1, x) of 2D materials like graphene. It achieves a spatial resolution of a few microns at a speed of a few tens of milliseconds. In this study, we demonstrate that the proposed microscopic dynamic spectroscopic imaging ellipsometer can provide spectroscopic ellipsometric phase data A(1) with 165 spectral bands in the visible range. It inspects a monolayer graphene flake area of 2.5 mm & lowast; 1.65 mm in just 1 min, which is the fastest 2D materials inspection capability ever reported, to our knowledge. (c) 2024 Optica Publishing Group
引用
收藏
页码:7135 / 7144
页数:10
相关论文
共 50 条
  • [41] A DYNAMIC GLOTTAL MODEL THROUGH HIGH-SPEED IMAGING
    Kong, Jiangping
    JOURNAL OF CHINESE LINGUISTICS, 2015, 43 (1B) : 311 - 336
  • [42] Dynamic regrasping using a high-speed multifingered hand and a high-speed vision system
    Furukawa, Noriatsu
    Namiki, Akio
    Taku, Senoo
    Ishikawa, Masatoshi
    2006 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION (ICRA), VOLS 1-10, 2006, : 181 - +
  • [43] High speed thin film thickness mapping by using dynamic spectroscopic imaging ellipsometry
    Kim, Daesuk
    Dembele, Vamara
    Choi, Sukhyun
    Hwang, Gukhyeon
    Kheiryzadehkhanghah, Saeid
    Choi, Inho
    Shim, Junbo
    OPTICAL TECHNOLOGY AND MEASUREMENT FOR INDUSTRIAL APPLICATIONS CONFERENCE 2022, 2022, 12480
  • [44] Real-time Simultaneous DKG and 2D DKG Using High-speed Digital Camera
    Kang, Duck-Hoon
    Wang, Soo-Geun
    Park, Hee-June
    Lee, Jin-Choon
    Jeon, Gye-Rok
    Choi, Ill-Sang
    Kim, Seon-Jong
    Shin, Bum-Joo
    JOURNAL OF VOICE, 2017, 31 (02) : 247.e1 - 247.e7
  • [45] Research on bubbles mineralization based on high-speed dynamic microscopic test
    Yan, Xiaokang (xk-yan@cumt.edu.cn), 1600, China University of Mining and Technology (45):
  • [46] Imaging in Voice Diagnostics: Stroboscopy, High-Speed Imaging, Dynamic MRI
    Richter, B.
    SPRACHE-STIMME-GEHOR, 2016, 40 (04): : 168 - 172
  • [47] High-speed microscopic imaging system with incoherent broadband optical source
    Chen, Hongwei
    2015 OPTO-ELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC), 2015,
  • [48] Molecular dynamics simulation of high-speed loading of 2D boron nitride
    Shepelev, I. A.
    Dmitriev, S., V
    Korznikova, E. A.
    LETTERS ON MATERIALS, 2021, 11 (01): : 79 - 83
  • [49] A biologically inspired method for estimating 2D high-speed translational motion
    Guan, BQ
    Wang, SG
    Wang, GB
    PATTERN RECOGNITION LETTERS, 2005, 26 (15) : 2450 - 2462
  • [50] High-Speed Strassen Matrix Multiplication Accelerators for 2D Kalman Filter
    Pudi, Mohan
    Dayananda, B. N.
    Achala, G.
    Srihari, Pathipati
    Pardhasaradhi, Bethi
    Cenkeramaddi, Linga Reddy
    10TH INTERNATIONAL CONFERENCE ON ELECTRONICS, COMPUTING AND COMMUNICATION TECHNOLOGIES, CONECCT 2024, 2024,