Simulation and Optimization of Large Scale Multiport Power Supply Noise for 2.5D IC

被引：0

作者：

Yang, Chenxi ^{[1
]}

Wu, Feng ^{[1
]}

Zhang, Jiangtao ^{[1
]}

Zhang, Jianguo ^{[1
]}

机构：

[1] ZTE Corp, State Key Lab Mobile Network & Mobile Multimedia, Shenzhen, Peoples R China

来源：

2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年

关键词：

Transfer impedance; Core Power Noise; Optimizing Capacitors; 2.5D IC; SI; PI;

D O I：

10.1109/ICEPT59018.2023.10492446

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

With the continuous development of advanced chip packaging technology, the excellent performance of packaged core power supplies plays a crucial role in the efficient operation of the entire chip. Especially for large scale 2.5D IC with high performance, the design and optimization of their core power supplies pose significant challenges. This article mainly introduces the simulation and optimization of large scale multiport core power supply noise for 2.5D IC.Among them, it mainly involves the introduction of the full link PDN Z transfer impedance and the automatic optimization method of large-scale capacitors.

引用

页数：5

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