Radiated Emissions Prediction of an Electronic Packaging Based on Near- field Scanning

被引：0
|
作者：
Wang, Di [1 ]
Wei, Xing-Chang [1 ]
机构：
[1] Zhejiang Univ, Coll Informat Sci & Elect Engn, Hangzhou, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
关键词：
electromagnetic compatibility; electromagnetic interference; near-field scanning; source reconstruction method; radiated emissions;
D O I：
10.1109/ICEPT59018.2023.10492105
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Integrated circuits (ICs) on printed circuit board (PCB) cause electromagnetic interference problems, source reconstruction method (SRM) based on near-field scanning is an accurate and efficient method to evaluate the radiated emissions of original ICs, by replacing them with simplified equivalent Hertz dipoles. The radiated emissions of Hertz dipoles can be easily obtained in simulation or by formula. Ideally, the radiated emissions of Hertz dipoles can be used to predict that of original ICs. One of the SRMs, dynamic differential evolution optimization method is verified with two typical applications. Most absolute error are below 2 dB which elaborates the proposed method meets most industrial requirements.
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页数：6
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