A STUDY ON PARAMETERS THAT IMPACT THE THERMAL FATIGUE LIFE OF BGA SOLDER JOINTS

被引：0

作者：

Deo, Karthik Arun ^{[1
]}

Kono, Raymond-Noel ^{[2
]}

Cai, Chongyang ^{[1
]}

Yang, Junbo ^{[1
]}

Lai, Yangyang ^{[1
]}

Park, Seungbae ^{[1
]}

机构：

[1] SUNY Binghamton, New York, NY 13902 USA

[2] Microsoft Corp, Redmond, WA USA

来源：

PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 | 2022年

关键词：

SMD; NSMD; Fatigue life; ATC Tests; BGA solder joints;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag-Cu 305 BGA (Ball Grid Array) solder balls are investigated to understand their impact on the number of cycles to failure under thermal fatigue life tests. Initially, accelerated thermal cycling fatigue tests on two electronic packages were conducted by three different vendors and it was observed that the results were significantly different. The first part of this study dwells into understanding the influence of parameters such as the solder mask design; SMD and NSMD, the variation in the solder ball geometry, copper pad thickness and diameter and material properties of the PCB on the accelerated thermal cycling performance of the BGA packages. The later part deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors.

引用

页数：9

共 50 条

[21] Thermal Fatigue Life Prediction of BGA Solder Joints Using a Creep Constitutive Equation Incorporating Microstructural Coarsening Effect
Morooka, Kouichi
Kariya, Yoshiharu
[J]. MATERIALS TRANSACTIONS, 2021, 62 (02) : 205 - 212
[22] Experimental Study on Thermal Fatigue Life Prediction Model of PBGA Solder Joints
Shao, Jiang
[J]. 2019 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-QINGDAO), 2019,
[23] THERMAL FATIGUE IN SOLDER JOINTS
FREAR, DR
GRIVAS, D
MORRIS, JW
[J]. JOURNAL OF METALS, 1988, 40 (06): : 18 - 22
[24] Impact reliability study of BGA solder joints and dropping test method
Yu, Q
Kikuchi, H
Watanabe, K
Siratori, M
Kakino, M
Fujiwara, N
[J]. ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 777 - 7821
[25] Fatigue Performance of Doped SAC Solder Joints in BGA Assembly
Wei, Xin
Su, Sinan
Hamasha, Sa'd
Ali, Haneen
Suhling, Jeff
Lall, Pradeep
[J]. PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 1035 - 1042
[26] A study of the effects of BGA solder geometry on fatigue life and reliability assessment
Yu, Q
Shiratori, M
Ohshima, Y
[J]. ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 229 - 235
[27] Factors Affecting Thermal Fatigue Life of LCCC Solder Joints
Krinke, T.A.
Pai, D.K.
[J]. Welding Journal (Miami, Fla), 1988, 67 (10): : 33 - 40
[28] FACTORS AFFECTING THERMAL FATIGUE LIFE OF LCCC SOLDER JOINTS
KRINKE, TA
PAI, DK
[J]. WELDING JOURNAL, 1988, 67 (10) : 33 - 40
[29] Effects of Microstructure on Thermal Fatigue Life Prediction of Solder Joints
Hiue Tran
Chua, Yin Fun
Yi, Sung
Geng, Phil
[J]. 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
[30] Impact of temperature cycle profile on fatigue life of solder joints
Dishongh, T
Basaran, C
Cartwright, AN
Zhao, Y
Liu, H
[J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 433 - 438

← 1 2 3 4 5 →